The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2024
Filed:
Oct. 26, 2021
Applicant:
Nanya Technology Corporation, New Taipei, TW;
Inventors:
Kai-Po Shang, Taoyuan, TW;
Jui-Hsiu Jao, Taoyuan, TW;
Assignee:
NANYA TECHNOLOGY CORPORATION, New Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/525 (2006.01); H01L 29/40 (2006.01); H01L 29/423 (2006.01); H10B 12/00 (2023.01);
U.S. Cl.
CPC ...
H01L 23/5252 (2013.01); H01L 29/401 (2013.01); H01L 29/4236 (2013.01); H01L 29/4238 (2013.01); H10B 12/01 (2023.02);
Abstract
A fuse component, a semiconductor device, and a method of manufacturing a fuse component are provided. The fuse component includes an active region having a surface, a fuse dielectric layer extending from the surface of the active region into the active region, and a gate metal layer surrounded by the fuse dielectric layer.