The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2024
Filed:
Jul. 15, 2022
Applicant:
Zeus Co., Ltd., Hwaseong-si, KR;
Inventors:
Seung Dae Baek, Hwaseong-si, KR;
Sung Yup Kim, Suwon-si, KR;
Jin Won Kim, Hwaseong-si, KR;
Jae Hwan Son, Hwaseong-si, KR;
Assignee:
ZEUS CO., LTD., Hwaseong-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/02 (2006.01); H01L 21/677 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68764 (2013.01); H01L 21/67034 (2013.01); H01L 21/67051 (2013.01); H01L 21/67778 (2013.01); H01L 21/6838 (2013.01);
Abstract
A wafer processing method of the present invention includes mounting a wafer part on a chuck table, loading the wafer part on the chuck table, spraying, by a spray arm module, a first processing solution onto the wafer part to process the wafer part, spraying, by the spray arm module, a second processing solution onto the wafer part to process the wafer part, drying the wafer part on the chuck table, and unloading the wafer part from the chuck table.