The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 2024

Filed:

Sep. 24, 2020
Applicants:

Denso Corporation, Kariya, JP;

Kabushiki Kaisha Toyota Chuo Kenkyusho, Nagakute, JP;

Inventors:

Megumi Suzuki, Kariya, JP;

Yasuo Yamamoto, Kariya, JP;

Teruhisa Akashi, Nagakute, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); B81B 7/00 (2006.01); H01L 21/02 (2006.01); H01L 23/08 (2006.01); H01L 23/10 (2006.01); H01L 21/311 (2006.01); H01L 29/84 (2006.01); G01P 15/08 (2006.01); G01P 15/125 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02164 (2013.01); B81B 7/0035 (2013.01); B81B 7/0061 (2013.01); B81C 1/00293 (2013.01); B81C 1/00349 (2013.01); H01L 21/31111 (2013.01); H01L 23/08 (2013.01); H01L 23/10 (2013.01); H01L 29/84 (2013.01); B81B 2201/02 (2013.01); B81C 2201/019 (2013.01); B81C 2203/03 (2013.01); G01P 15/0802 (2013.01); G01P 15/125 (2013.01);
Abstract

A recess is formed in one silicon substrate. A silicon oxide film is formed in another one silicon substrate at a portion space apart from a space-to-be-formed region. The silicon oxide film has a groove surrounding the space-to-be-formed region and extending to an outer periphery of the other one silicon substrate. Further, the other one silicon substrate and the one silicon substrate are directly bonded to each other via the silicon oxide film so as to cover the groove. A gas discharge passage, a stacking structure of the silicon substrates and the silicon oxide film are formed, and the space is formed inside the stacking structure by the recess. Then, by the heat treatment, the gas inside the space is discharged to the outside of the stacking structure through the gas discharge passage.


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