The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 2024

Filed:

Apr. 19, 2023
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Wendell Glenn Boyd, Jr., Morgan Hill, CA (US);

Govinda Raj, Santa Clara, CA (US);

Matthew James Busche, Santa Clara, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01D 5/26 (2006.01); H01J 37/32 (2006.01); H01L 21/683 (2006.01); C23C 16/458 (2006.01); G01L 11/02 (2006.01); G01D 11/24 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3244 (2013.01); C23C 16/4586 (2013.01); H01J 37/32009 (2013.01); H01J 37/3299 (2013.01); H01J 37/32697 (2013.01); H01J 37/32715 (2013.01); H01L 21/6831 (2013.01); H01L 21/6833 (2013.01); G01D 5/26 (2013.01); G01D 5/266 (2013.01); G01D 5/268 (2013.01); G01D 11/245 (2013.01); G01L 11/025 (2013.01); H01J 2237/334 (2013.01);
Abstract

Embodiments disclosed herein include a substrate support having a sensor assembly, and processing chamber having the same. In one embodiment, a substrate support assembly has a puck having a workpiece support surface, a gas hole formed through the workpiece support surface, and a sensor assembly disposed in the gas hole. The substrate support assembly further has a transition conduit fluidly coupled to the gas hole, and a connection coupled to the transition conduit. The connection has a first opening fluidly coupled to the transition conduit and a second opening coupled to a control system, where the control system is coupled to the sensor assembly.


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