The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2024
Filed:
Oct. 12, 2021
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Hee Sun Chun, Suwon-si, KR;
Hyoung Uk Kim, Suwon-si, KR;
Jae Sung Park, Suwon-si, KR;
Hyeg Soon An, Suwon-si, KR;
Ku Tak Lee, Suwon-si, KR;
Eun Ha Jang, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2006.01); C04B 35/468 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/224 (2006.01); C04B 35/64 (2006.01);
U.S. Cl.
CPC ...
H01G 4/30 (2013.01); C04B 35/4682 (2013.01); H01G 4/012 (2013.01); H01G 4/1227 (2013.01); H01G 4/224 (2013.01); C04B 35/64 (2013.01);
Abstract
A multilayer electronic component includes a body including a plurality of dielectric layers, side margin portions disposed on the body, and external electrodes disposed on the body. The reliability of the multilayer electronic component is improved by controlling the contents of Si for each position of the dielectric layer and the side margin portion.