The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 2024

Filed:

Jun. 12, 2020
Applicant:

Mitsubishi Power, Ltd., Kanagawa, JP;

Inventors:

Yoshifumi Okajima, Tokyo, JP;

Masahiko Mega, Tokyo, JP;

Taiji Torigoe, Tokyo, JP;

Atsushi Moriwaki, Tokyo, JP;

Hiroshi Makigano, Tokyo, JP;

Koichi Tanimoto, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F02C 7/24 (2006.01); C23C 4/073 (2016.01); C23C 4/134 (2016.01); G01N 25/18 (2006.01); F01D 5/28 (2006.01); F01D 17/08 (2006.01); F01D 21/00 (2006.01);
U.S. Cl.
CPC ...
F02C 7/24 (2013.01); C23C 4/073 (2016.01); C23C 4/134 (2016.01); F01D 5/288 (2013.01); F01D 17/085 (2013.01); F01D 21/003 (2013.01); G01N 25/18 (2013.01); F05D 2220/32 (2013.01); F05D 2230/312 (2013.01); F05D 2230/90 (2013.01); F05D 2260/231 (2013.01); F05D 2270/80 (2013.01); F05D 2300/2118 (2013.01); F05D 2300/514 (2013.01); F05D 2300/611 (2013.01);
Abstract

The present invention provides a thermal barrier coated component, monitoring or evaluation of the soundness of which is able to be adequately carried out on the basis of the thermal boundary conditions that are detected by a sensor. A thermal barrier coated component according to the present invention comprises: a base material; a first bond coat layer that is a metal bonding layer formed on the base material; a sensor unit that comprises a sensor and a conductive wire, which are formed on the first bond coat layer; a second bond coat layer that is formed on the first bond coat layer so as to cover at least the sensor unit, while having a surface roughness higher than that of the first bond coat layer; and a top coat layer that is formed on the second bond coat layer.


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