The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 2024

Filed:

Sep. 22, 2020
Applicant:

Kokusai Electric Corporation, Tokyo, JP;

Inventors:

Motoya Takewaki, Toyama, JP;

Tomoshi Taniyama, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/673 (2006.01); C23C 16/52 (2006.01); C23C 16/458 (2006.01);
U.S. Cl.
CPC ...
C23C 16/52 (2013.01); C23C 16/4584 (2013.01); H01L 21/67303 (2013.01);
Abstract

Described herein is a technique capable of improving a uniformity of a semiconductor manufacturing process by placing a substrate at an appropriate position on the basis of actual installation dimensions of a reaction tube. According to one aspect of the technique, there is provided a substrate processing apparatus including: a boat on which substrates are placed; a process furnace including a reaction tube into which the boat is to be inserted, wherein a film is formed on the substrates placed on the boat in the reaction tube; and a substrate transport device configured to transfer the substrates into the boat, wherein the substrates are transferred into the boat by the substrate transport device referring to a virtual center axis of the reaction tube measured in advance.


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