The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 2024

Filed:

Nov. 08, 2019
Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Gi Dae Choi, Daejeon, KR;

Minsu Kim, Daejeon, KR;

Eon Seok Lee, Daejeon, KR;

Assignee:

LG CHEM, LTD., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 77/02 (2006.01); C08L 23/06 (2006.01); C08L 23/12 (2006.01); C08L 23/16 (2006.01); C08L 25/10 (2006.01); C08K 3/04 (2006.01);
U.S. Cl.
CPC ...
C08L 77/02 (2013.01); C08L 23/06 (2013.01); C08L 23/12 (2013.01); C08L 23/16 (2013.01); C08L 25/10 (2013.01); C08K 3/046 (2017.05); C08K 2201/006 (2013.01);
Abstract

The present invention relates to a conductive concentrated resin composition including (a) 100 parts by weight of a base resin including 50 to 95% by weight of a polyamide resin, 2.5 to 20% by weight of a polar polymer, and 2.5 to 30% by weight of a non-polar polymer, (b) 10 to parts by weight of a carbon nanofibril, (c) 0.5 to 5 parts by weight of a carbon nanoplate, and (d) 0.5 to 4 parts by weight of nanoclay; a conductive polyamide resin composition including the conductive concentrated resin composition; a method of preparing the conductive concentrated resin composition; and a molded article including the conductive polyamide resin composition. When a polyamide alloy resin composition is prepared using the conductive concentrated resin composition of the present invention, compatibility between compositions and dispersion stability may be improved, thereby significantly increasing moisture stability while maintaining mechanical strength, conductivity, heat resistance, and appearance properties equal or superior to those of a conventional conductive polyamide alloy resin composition.


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