The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2024
Filed:
Apr. 24, 2023
Magic Leap, Inc., Plantation, FL (US);
Steven Alexander-Boyd Hickman, Seattle, WA (US);
Sarah Colline McQuaide, Seattle, WA (US);
Abhijith Rajiv, Mountain View, CA (US);
Brian T. Schowengerdt, Seattle, WA (US);
Charles David Melville, Camano Island, WA (US);
Magic Leap, Inc., Plantation, FL (US);
Abstract
A semiconductor substrate includes a first semiconductor layer, a first dielectric layer coupled to the first semiconductor layer, and a second semiconductor layer coupled to the first dielectric layer. The second semiconductor layer includes a base portion substantially aligned with the first dielectric layer and a cantilever portion protruding from an end of the first dielectric layer. The cantilever portion includes a tapered surface tapering from a bottom surface of the second semiconductor layer toward a top surface of the second semiconductor layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile