The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 2024

Filed:

Mar. 05, 2021
Applicant:

Sumitomo Riko Company Limited, Aichi, JP;

Inventors:

Masayoshi Nakano, Aichi, JP;

Tsubasa Shinozuka, Aichi, JP;

Hiroaki Ito, Aichi, JP;

Shigeaki Takamatsu, Aichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03K 17/96 (2006.01); B62D 1/06 (2006.01); G01V 3/08 (2006.01);
U.S. Cl.
CPC ...
B62D 1/06 (2013.01); G01V 3/088 (2013.01); H03K 17/962 (2013.01); H03K 2217/960755 (2013.01);
Abstract

A capacitance sensor () is provided with two electrode layers () and an insulating layer () disposed between the electrode layers (). At least one of the two electrode layers () is constituted by a reticulated soft electrode () that is formed from a conductive polymer and has a reticulated shape. The conductive polymer comprises a polymer and a conductive material dispersed in the polymer and has an elastic modulus of 1000 MPa or less. This method for manufacturing the capacitance sensor () in which the two electrode layers () are constituted by the reticulated soft electrode () comprises: an electrode manufacturing step in which the reticulated soft electrode () is manufactured; and a laminating step in which the reticulated soft electrode () is laminated onto the front and back surfaces of the insulating layer ().


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