The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2024
Filed:
Mar. 13, 2018
Applicant:
Hewlett-packard Development Company, L.p., Spring, TX (US);
Inventors:
Kristopher J. Erickson, Palo Alto, CA (US);
David George, Palo Alto, CA (US);
Sterling Chaffins, Corvallis, OR (US);
Lihua Zhao, Palo Alto, CA (US);
Assignee:
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/165 (2017.01); B22F 7/08 (2006.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 70/00 (2020.01); B29C 64/194 (2017.01); B29C 64/112 (2017.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01); H05K 3/32 (2006.01); H05K 3/46 (2006.01); B29K 105/16 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
B22F 7/08 (2013.01); B29C 64/112 (2017.08); B29C 64/165 (2017.08); B29C 64/194 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 70/00 (2014.12); H05K 1/186 (2013.01); H05K 3/284 (2013.01); H05K 3/32 (2013.01); H05K 3/4664 (2013.01); B29K 2105/162 (2013.01); B29K 2995/0005 (2013.01); B29L 2031/3425 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/10628 (2013.01); H05K 2203/1131 (2013.01);
Abstract
In an example, a method is described that includes building a first layer of a three-dimensional heterogeneous object in a first plurality of passes of an additive manufacturing system. An electronic component is inserted directly into the first layer. The electronic component is then fused to the first layer in a second plurality of passes of the additive manufacturing system.