The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 2024

Filed:

May. 25, 2018
Applicant:

Biosense Webster (Israel) Ltd., Yokneam, IL;

Inventors:

Christopher Thomas Beeckler, Brea, CA (US);

Joseph Thomas Keyes, Sierra Madre, CA (US);

Assaf Govari, Haifa, IL;

Yigal Ultchin, Rehovot, IL;

Meir Bar-tal, Haifa, IL;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61B 18/14 (2006.01); C25D 5/00 (2006.01); C25D 5/10 (2006.01); A61B 17/00 (2006.01); A61B 18/00 (2006.01); B23P 19/04 (2006.01);
U.S. Cl.
CPC ...
A61B 18/1492 (2013.01); C25D 5/10 (2013.01); C25D 5/611 (2020.08); A61B 2017/00526 (2013.01); A61B 2018/00029 (2013.01); A61B 2018/00077 (2013.01); A61B 2018/00083 (2013.01); A61B 2018/00351 (2013.01); A61B 2018/00577 (2013.01); A61B 2018/00779 (2013.01); A61B 2018/00821 (2013.01); A61B 2018/00839 (2013.01); A61B 2018/00875 (2013.01); B23P 19/04 (2013.01);
Abstract

Described embodiments include an apparatus that includes a flexible electrically-insulating substrate, including an inner surface and an outer surface, and shaped to define (i) multiple narrower channels passing between the inner surface and the outer surface, and (ii) one or more wider channels passing between the inner surface and the outer surface. The apparatus further includes an outer layer of an electrically-conducting metal covering at least part of the outer surface, an inner layer of the electrically-conducting metal covering at least part of the inner surface, a plating layer of the electrically-conducting metal that plates the wider channels such as to connect the outer layer to the inner layer, and respective columns of the electrically-conducting metal that fill the narrower channels such as to connect the outer layer to the inner layer. Other embodiments are also described.


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