The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2024

Filed:

Feb. 02, 2023
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Chin-Jen Tseng, Fremont, CA (US);

Jessica Liu Strohmann, Cupertino, CA (US);

Ila Badge, San Jose, CA (US);

Shiang-Chi Lin, Taoyuan, TW;

Min-Lun Yang, Miaoli County, TW;

Hrishikesh Vijaykumar Panchawagh, Cupertino, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06V 40/13 (2022.01); H10N 30/00 (2023.01); H10K 59/90 (2023.01); G06V 40/12 (2022.01); H10N 39/00 (2023.01);
U.S. Cl.
CPC ...
H10N 30/10516 (2023.02); G06V 40/1306 (2022.01); G06V 40/1347 (2022.01); H10K 59/90 (2023.02); H10N 39/00 (2023.02);
Abstract

An apparatus includes an ultrasonic sensor stack, a foldable display stack that includes a display stiffener, and an additional stiffener between the ultrasonic sensor stack and the foldable display stack. The additional stiffener forms an acoustic resonator with the display stiffener and an adhesive layer between the display stiffener and the additional stiffener in order to amplify transmission of ultrasonic waves transmitted by the ultrasonic sensor stack. The additional stiffener includes a material having a high modulus of elasticity, low density, and high acoustic impedance value. In some cases, the additional stiffener includes a metal, a ceramic, a glass, or a glass ceramic. The additional stiffener increases an overall stiffness and mechanical integrity of the apparatus so that a foam backer may be omitted from the ultrasonic sensor stack.


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