The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2024

Filed:

Apr. 13, 2023
Applicant:

Pacific Star Communications, Inc., Portland, OR (US);

Inventor:

Dalton Dawkins, Portland, OR (US);

Assignee:

PACIFIC STAR COMMUNICATIONS, Portland, OR (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 5/06 (2006.01); H05K 7/14 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20409 (2013.01); H05K 5/06 (2013.01); H05K 7/1427 (2013.01);
Abstract

A thermal management system for use in a sealed communications module and associated systems and methods are disclosed herein. In some embodiments, the communications model includes a sealed housing and a circuit board assembly having one or more heat-generating electronic components positioned within the housing. The thermal management system is coupled to the circuit board assembly and positioned to disperse heat from the one or more electronic components. The thermal management system includes a first thermal pathway, a second thermal pathway, and a third thermal pathway. The first thermal pathway has a first end attached to the circuit board assembly and a second end positioned near the side wall of the housing. The second thermal pathway is coupled to the second end of the first thermal pathway. The third thermal pathway is coupled to the second end of the first thermal pathway.


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