The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2024
Filed:
Aug. 15, 2022
Dsbj Pte. Ltd., Singapore, SG;
Pui Yin Yu, Hong Kong, CN;
Hong Tu Zhang, Zhuhai, CN;
Abstract
Embodiments and fabrication methods for a printed circuit board comprising two or more electrically conductive layers, including at least a first conductive layer opposing and adjacent to a second conductive layer. Also including one or more electrically non-conductive layers including at least a first non-conductive layer disposed between the first conductive layer and the second conductive layer. A first copper pad is included on the first conductive layer. A second copper pad is included on the second conductive layer. There is a conductive via extending through the first non-conductive layer and electrically connecting the first copper pad to the second copper pad and solder mask material on the first copper pad around the via.