The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2024

Filed:

Mar. 11, 2021
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Song I Kim, Suwon-si, KR;

Mi Sun Hwang, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/11 (2006.01); H01L 23/498 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H05K 1/03 (2013.01); H05K 1/185 (2013.01);
Abstract

A substrate with an electronic component embedded therein includes: a core layer having a through-portion; an electronic component disposed in the through-portion; an encapsulant disposed on a lower surface of the core layer, disposed in at least a portion of the through-portion, and covering at least a portion of a lower surface of the electronic component; and a build-up structure disposed on an upper surface of the core layer, and including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers.


Find Patent Forward Citations

Kim, Song. (2024). Substrate with electronic component embedded therein (U.S. Patent No. 11910527). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11910527

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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