The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2024
Filed:
Nov. 08, 2019
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Hongki Moon, Gyeonggi-do, KR;
Yoonsun Park, Gyeonggi-do, KR;
Seunghoon Kang, Gyeonggi-do, KR;
Kyungha Koo, Gyeonggi-do, KR;
Seyoung Jang, Gyeonggi-do, KR;
Woojune Jung, Gyeonggi-do, KR;
Samsung Electronics Co., Ltd, , KR;
Abstract
Disclosed is an electronic device including a heat dissipation structure that includes a first printed circuit board; a thermal diffusion member arranged in parallel to the first printed circuit board; a second printed circuit board which is arranged to be separated from the first printed circuit board and which is electrically connected with the first printed circuit board; and a heat transfer member of which at least a partial area faces a heat dissipation member, and of which at least another partial area, formed to be bent, is arranged to face one surface of the second printed circuit, and additional other various embodiments are possible.