The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2024

Filed:

Dec. 01, 2020
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Yoshihisa Inoue, Nagaokakyo, JP;

Masakazu Fukumitsu, Nagaokakyo, JP;

Yuichi Goto, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/10 (2006.01); B81B 7/00 (2006.01); H03H 9/02 (2006.01); H03H 9/24 (2006.01);
U.S. Cl.
CPC ...
H03H 9/1057 (2013.01); B81B 7/0038 (2013.01); H03H 9/02259 (2013.01); H03H 9/2457 (2013.01); B81B 2201/0271 (2013.01); B81B 2207/07 (2013.01);
Abstract

A MEMS device that includes a substrate including an element and a connection wiring electrically connected to the element, and a connection portion electrically connected to the connection wiring. The connection portion is formed of a eutectic alloy of a first metal and a second metal. A line width of the connection wiring is smaller than a width of the connection portion when a main surface of the substrate is viewed in a plan view.


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