The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2024

Filed:

Dec. 09, 2022
Applicants:

Shanghai Jinko Green Energy Enterprise Management Co., Ltd., Shanghai, CN;

Zhejiang Jinko Solar Co., Ltd., Zhejiang, CN;

Inventors:

Zhiqiu Guo, Zhejiang, CN;

Yidong Hu, Zhejiang, CN;

Yichao Yao, Zhejiang, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/18 (2006.01); H01L 31/042 (2014.01); H01L 31/02 (2006.01); B23K 1/005 (2006.01);
U.S. Cl.
CPC ...
H01L 31/186 (2013.01); B23K 1/0056 (2013.01); H01L 31/02021 (2013.01); H01L 31/042 (2013.01);
Abstract

A photovoltaic module, including a laminate including a solder strip; and a junction box arranged on a surface of the laminate and including a plate connected to the solder strip by laser soldering. The plate has a first region and a second region, in which a region covered by the solder strip on the plate is the first region, and a region not covered by the solder strip on the plate is the second region. A soldering seam formed by laser soldering includes a first soldering seam and a second soldering seam. The first soldering seam is located in the first region, and the first soldering seam extends through the solder strip into the plate along a thickness direction of the laminate. The second soldering seam is located in the second region, and the second soldering seam extends directly into the plate along the thickness direction of the laminate.


Find Patent Forward Citations

Loading…