The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2024

Filed:

Nov. 03, 2021
Applicant:

Semiconductor Energy Laboratory Co., Ltd., Atsugi, JP;

Inventors:

Yuki Okamoto, Sagamihara, JP;

Yoshiyuki Kurokawa, Sagamihara, JP;

Hiroki Inoue, Atsugi, JP;

Takuro Ohmaru, Zama, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 21/8234 (2006.01); H01L 27/088 (2006.01); H01L 27/12 (2006.01); H04N 23/54 (2023.01); H01L 29/786 (2006.01); H01L 31/075 (2012.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14603 (2013.01); H01L 21/8234 (2013.01); H01L 27/088 (2013.01); H01L 27/1225 (2013.01); H01L 27/1255 (2013.01); H01L 27/146 (2013.01); H01L 27/1461 (2013.01); H01L 27/1463 (2013.01); H01L 27/14609 (2013.01); H01L 27/14612 (2013.01); H01L 27/14616 (2013.01); H01L 27/14643 (2013.01); H01L 27/14692 (2013.01); H01L 29/7869 (2013.01); H01L 31/075 (2013.01); H04N 23/54 (2023.01); H01L 23/5286 (2013.01);
Abstract

A solid-state imaging device with high productivity and improved dynamic range is provided. In the imaging device including a photoelectric conversion element having an i-type semiconductor layer, functional elements, and a wiring, an area where the functional elements and the wiring overlap with the i-type semiconductor in a plane view is preferably less than or equal to 35%, further preferably less than or equal to 15%, and still further preferably less than or equal to 10% of the area of the i-type semiconductor in a plane view. Plural photoelectric conversion elements are provided in the same semiconductor layer, whereby a process for separating the respective photoelectric conversion elements can be reduced. The respective i-type semiconductor layers in the plural photoelectric conversion elements are separated by a p-type semiconductor layer or an n-type semiconductor layer.


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