The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2024

Filed:

Sep. 01, 2020
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Yung-Yu Hsu, San Jose, CA (US);

Chaohao Wang, Sunnyvale, CA (US);

Jonathan C. Moisant-Thompson, San Jose, CA (US);

Kuan H. Lu, Santa Clara, CA (US);

Mingjing Ha, Cupertino, CA (US);

Paul S. Drzaic, Morgan Hill, CA (US);

Yang Li, San Jose, CA (US);

Yi-Pai Huang, Cupertino, CA (US);

Nathaniel T. Lawrence, San Francisco, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2023.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01);
Abstract

A display may include light-emitting components such as light-emitting diodes on a transparent substrate. Conductive signal paths between the light-emitting components, driver integrated circuits for controlling the light-emitting components, and the light-emitting components themselves may be opaque. To mitigate diffraction artifacts caused by the opaque components, the opaque footprint of the display may be selected to include non-periodic portions. The non-periodic portions increase randomness and reduce periodicity within the opaque footprint, which mitigates perceptible diffraction artifacts when viewing the display. One or both of the component mounting portions and interconnect portions of the opaque footprint may be non-periodic. The component mounting portions may have random shapes. The interconnect portions may follow random paths between the component mounting portions.


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