The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2024
Filed:
Dec. 21, 2021
Applicant:
Commissariat À L'energie Atomique ET Aux Energies Alternatives, Paris, FR;
Inventors:
Assignee:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/52 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/97 (2013.01); H01L 21/52 (2013.01); H01L 24/08 (2013.01); H01L 2224/08235 (2013.01);
Abstract
The invention relates to a process for collectively bending microelectronic components comprising transferring microelectronic components () to and bending them on curved surfaces () of a shaping carrier (), an adhesive layer () ensuring adhesion of the microelectronic components (), and comprising producing conductive vias () that extend through the shaping carrier () and the adhesive lower layer (), from the lower face () of the shaping carrier (), in order to emerge onto the lower conductive pads () of the microelectronic components ().