The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2024
Filed:
May. 20, 2021
Stmicroelectronics (Crolles 2) Sas, Crolles, FR;
Stmicroelectronics (Grenoble 2) Sas, Grenoble, FR;
Eric Sabouret, Saint Ismier, FR;
Krysten Rochereau, Allevard, FR;
Olivier Hinsinger, Barraux, FR;
Flore Persin-Crelerot, Eybens, FR;
STMicroelectronics (Crolles 2) SAS, Crolles, FR;
STMicroelectronics (Grenoble 2) SAS, Grenoble, FR;
Abstract
An integrated circuit includes a solder pad which includes, in a superposition of metallization levels, an underlying structure formed by a network of first regular metal tracks that are arranged for reinforcing the mechanical strength of the underlying structure and electrically connecting between an upper metallization level and a lower metallization level of the underlying structure. The underlying structure further includes a detection electrical path formed by second metal tracks passing between the first metal tracks in the metallization levels, the detection electrical path having an input terminal and an output terminal. Electrical sensing of the detection electrical path is made to supply a measurement which is indicative of the presence of cracks in the underlying structure.