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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11908777 B1

PDFFull Text
Date of Patent:
Feb. 20, 2024

Filed:

May. 27, 2022

Semiconductor package with plurality of leads and sealing resin

Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventor:

Mamoru Yamagami, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:

XSENSUS LLP

Primary Examiner:

Mamadou L Diallo

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 21/52 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49513 (2013.01); H01L 21/4825 (2013.01); H01L 21/4842 (2013.01); H01L 21/52 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 23/3142 (2013.01); H01L 23/49524 (2013.01); H01L 23/49548 (2013.01); H01L 23/49582 (2013.01); H01L 21/561 (2013.01); H01L 23/3121 (2013.01); H01L 23/4951 (2013.01); H01L 23/49541 (2013.01); H01L 23/49575 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/97 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19105 (2013.01);
Abstract

A semiconductor device includes a semiconductor chip, a plurality of leads that each includes a lead body portion which has a mounting portion which includes an upper surface whereon a semiconductor chip is bonded, and a lead connecting portion for external connection which projects downward from a lower surface of the lead body portion, a first sealing resin that seals a space that is defined by each lead body portion and each lead connecting portion of the plurality of leads in a region below the upper surface of each lead body portion of the plurality of leads, and a second sealing resin that seals the semiconductor chip in a region above the upper surface of each lead body portion of the plurality of leads.

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