The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2024
Filed:
Dec. 14, 2021
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/16 (2006.01); H01L 23/053 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/16 (2013.01); H01L 23/053 (2013.01); H01L 23/31 (2013.01);
Abstract
A semiconductor package includes; a dual stiffener including an upper stiffener and a lower stiffener, an upper package including an upper package substrate, a semiconductor chip centrally mounted on an upper surface of the upper package substrate, and the upper stiffener disposed along an outer edge of the upper package substrate, and a lower package substrate that centrally mounts the upper package and includes the lower stiffener disposed on an upper surface of the lower package substrate to surround the upper package substrate.