The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2024
Filed:
Oct. 01, 2021
Applicant:
Semsysco Gmbh, Salzburg, AT;
Inventors:
Franz Markut, St. Georgen, AT;
Thomas Wirnsberger, Seeboden, AT;
Oliver Knoll, Salzburg, AT;
Andreas Gleissner, Döbriach, AT;
Harald Okorn-Schmidt, Klagenfurt, AT;
Philipp Engesser, Villach, AT;
Assignee:
SEMSYSCO GMBH, Salzburg, AT;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/34 (2006.01); H01L 21/288 (2006.01); C25D 7/12 (2006.01); C25D 5/02 (2006.01); C25D 17/00 (2006.01); C25D 21/04 (2006.01); C25D 5/00 (2006.01); H01L 21/768 (2006.01); H05K 3/42 (2006.01); B05C 3/00 (2006.01); B05C 3/02 (2006.01); B05C 9/14 (2006.01); C25D 21/12 (2006.01);
U.S. Cl.
CPC ...
H01L 21/2885 (2013.01); B05C 3/005 (2013.01); B05C 3/02 (2013.01); B05C 9/14 (2013.01); C25D 5/003 (2013.01); C25D 5/02 (2013.01); C25D 5/34 (2013.01); C25D 7/123 (2013.01); C25D 17/001 (2013.01); C25D 21/04 (2013.01); C25D 21/12 (2013.01); H01L 21/76877 (2013.01); H05K 3/42 (2013.01);
Abstract
The invention relates to a method for plating a recess in a substrate, a device for plating a recess in a substrate and a system for plating a recess in a substrate comprising the device. The method for plating a recess in a substrate comprises the following steps: