The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2024

Filed:

Jun. 10, 2022
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventor:

Tomoaki Hirai, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/012 (2006.01); H01G 4/30 (2006.01); H01G 4/232 (2006.01); H01G 4/12 (2006.01); H01G 4/008 (2006.01);
U.S. Cl.
CPC ...
H01G 4/012 (2013.01); H01G 4/30 (2013.01); H01G 4/008 (2013.01); H01G 4/1227 (2013.01); H01G 4/1236 (2013.01); H01G 4/2325 (2013.01);
Abstract

A multilayer ceramic electronic component includes a multilayer body including stacked ceramic layers, internal conductive layers stacked on the ceramic layers, first and second main surfaces opposing each other in a height direction, first and second side surfaces opposing each other in a width direction perpendicular or substantially perpendicular to the height direction, and first and second end surfaces opposing each other in a length direction perpendicular or substantially perpendicular to the height direction and the width direction, and external electrodes connected to the internal conductive layers. The internal conductive layers include holes having a different area equivalent diameter. When an area equivalent diameter in which a cumulative value in a cumulative distribution of area equivalent diameters of the holes in each of the internal conductive layers becomes about 99% is defined as an area equivalent diameter D, the area equivalent diameter Dis about 8.0 μm or less.


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