The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2024
Filed:
Dec. 12, 2016
Applicants:
Autonetworks Technologies, Ltd., Mie, JP;
Sumitomo Wiring Systems, Ltd., Mie, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
Inventors:
Assignees:
AutoNetworks Technologies, Ltd., Yokkaichi, JP;
Sumitomo Wiring Systems, Ltd., Yokkaichi, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 1/00 (2006.01); H01F 27/255 (2006.01); H01F 41/063 (2016.01); H01F 1/20 (2006.01); H01F 3/08 (2006.01); H01F 3/10 (2006.01); H01F 27/28 (2006.01); H01F 27/26 (2006.01); H01F 41/02 (2006.01); H01F 37/00 (2006.01); C08K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01F 27/255 (2013.01); C08K 3/34 (2013.01); H01F 1/20 (2013.01); H01F 3/08 (2013.01); H01F 3/10 (2013.01); H01F 27/263 (2013.01); H01F 27/2823 (2013.01); H01F 37/00 (2013.01); H01F 41/0246 (2013.01); H01F 41/063 (2016.01);
Abstract
Provided is a composite material molded article including soft magnetic powder and resin containing the soft magnetic powder in a dispersed state. The composite material molded article is provided with a roughened region having an arithmetic average roughness Ra of 3.0 μm or more on at least a portion of its surfaces.