The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2024

Filed:

Jan. 06, 2023
Applicant:

Lextar Electronics Corporation, Hsinchu, TW;

Inventors:

Yun-Yi Tien, Hsinchu, TW;

Yu-Chang Wu, Hsinchu, TW;

Yu-Li Chang, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/13357 (2006.01); G02F 1/1335 (2006.01); H01L 33/54 (2010.01); H01L 33/60 (2010.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
G02F 1/133603 (2013.01); G02F 1/133607 (2021.01); G02F 1/133611 (2013.01); G02F 1/133614 (2021.01); H01L 33/005 (2013.01); H01L 33/54 (2013.01); H01L 33/60 (2013.01); G02F 2202/36 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0058 (2013.01);
Abstract

A light emitting device includes a substrate, a conductive layer, first and second reflective layers, a light emitting element, and an encapsulation layer. The conductive layer is disposed on the substrate. The first reflective layer covers the conductive layer and has an opening exposing a portion of the conductive layer. The light emitting element is disposed in the opening and electrically connects to the conductive layer. The second reflective layer is disposed on the first reflective layer and surrounds the light emitting element. The second reflective layer has an outer diameter. A top surface of the second reflective layer is lower than a top surface of the light emitting element. The encapsulation layer covers the light emitting element. There is a height between a highest point of the encapsulation layer and an upper surface of the first reflective layer. The encapsulating layer is directly contact with the outer diameter.


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