The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2024
Filed:
Jan. 18, 2022
Seiko Epson Corporation, Tokyo, JP;
Masayasu Sakuma, Shiojiri, JP;
SEIKO EPSON CORPORATION, Tokyo, JP;
Abstract
A sensor module includes: a printed circuit board having a first recessed portion formed at a first side, a second recessed portion formed at a second side facing the first side, a third recessed portion formed at a third side, and a fourth recessed portion formed at a fourth side facing the third side; a metal cap including convex portions each bonded to a respective one of the first to fourth recessed portions; and a first inertial sensor and a second inertial sensor that are provided at a main surface of the printed circuit board. The first inertial sensor and the second inertial sensor are disposed outside a region surrounded by a line connecting both ends of the first recessed portion and the second recessed portion and outside a region surrounded by a line connecting both ends of the third recessed portion and the fourth recessed portion.