The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2024

Filed:

Oct. 27, 2020
Applicant:

Ylx Incorporated, Guangdong, CN;

Inventors:

Quan Zhang, Guangdong, CN;

Jinjiang Fu, Guangdong, CN;

Hui Chen, Guangdong, CN;

Assignee:

YLX INCORPORATED, Guangdong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 5/00 (2018.01); G02B 19/00 (2006.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
F21V 5/007 (2013.01); F21V 5/008 (2013.01); G02B 19/0009 (2013.01); G02B 19/0066 (2013.01); F21Y 2115/10 (2016.08);
Abstract

A light source system and a light-emitting device are provided. The light source system includes an array of light-emitting diodes, the light-emitting diodes including light-emitting diode chips; a collimating lens group located on a light path of light emitted by the array of the light-emitting diodes, the collimating lens group being configured to collimate light beams emitted by the light-emitting diode chips; and a fly-eye lens arranged on a light path of light outputted from the collimating lens group. The fly-eye lens includes micro lens units corresponding to the light-emitting diode chips, and for at least one light-emitting diode chip of the light-emitting diode chips, an image formed by each of at least one light-emitting diode chip on surfaces of the micro lens units is completely within a surface of one of the micro lens units. A ratio of side lobes is reduced, thereby improving the energy utilization rate.


Find Patent Forward Citations

Loading…