The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2024

Filed:

Sep. 19, 2019
Applicant:

Kanto Kagaku Kabushiki Kaisha, Tokyo, JP;

Inventor:

Areji Takanaka, Saitama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C11D 3/37 (2006.01); C11D 11/00 (2006.01); C11D 1/16 (2006.01); C11D 7/08 (2006.01); C11D 7/26 (2006.01); C11D 7/32 (2006.01); C11D 7/50 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
C11D 11/0047 (2013.01); C11D 1/16 (2013.01); C11D 7/08 (2013.01); C11D 7/261 (2013.01); C11D 7/266 (2013.01); C11D 7/267 (2013.01); C11D 7/3209 (2013.01); C11D 7/50 (2013.01); H01L 21/02068 (2013.01);
Abstract

An object of the present invention is to provide a cleaning liquid that effectively removes in a short time organic residues and abrasive grains derived from a slurry in a semiconductor substrate in which a Co contact plug and/or Co wiring are present. The present invention relates to a cleaning liquid composition for cleaning a substrate having a Co contact plug and/or Co wiring, which contains one or more reducing agents and water. Furthermore, the present invention relates to a cleaning liquid composition for cleaning a substrate having Co and not having Cu, which contains one or more reducing agents and water and has a pH of 3 or more and less than 12.


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