The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2024

Filed:

Nov. 18, 2019
Applicant:

Appotronics Corporation Limited, Guangdong, CN;

Inventors:

Jie Wang, Guangdong, CN;

Lin Wang, Guangdong, CN;

Hongxiu Zhang, Guangdong, CN;

Fei Hu, Guangdong, CN;

Yi Li, Guangdong, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 7/25 (2018.01); C09J 7/24 (2018.01); C09J 5/00 (2006.01); G03B 21/56 (2006.01);
U.S. Cl.
CPC ...
C09J 7/255 (2018.01); C09J 5/00 (2013.01); C09J 7/243 (2018.01); C09J 7/245 (2018.01); G03B 21/56 (2013.01); C09J 2301/312 (2020.08); C09J 2423/046 (2013.01); C09J 2423/106 (2013.01); C09J 2427/006 (2013.01); C09J 2467/006 (2013.01);
Abstract

A screen splicing structure is provided. The screen splicing structure includes a substrate layer, a middle adhesive layer, and a surface layer. The substrate layer includes a first substrate and a second substrate. The second substrate is spliced with the first substrate, and a seam is formed at a splicing place. The surface layer and the middle adhesive layer are stacked. The surface layer covers the seam by bonding the middle adhesive layer and the substrate layer. The peeling strength of the surface layer and the substrate layer is greater than or equal to 1,000 gf/inch. A method for forming the screen splicing structure is also provided.


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