The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2024

Filed:

Jun. 22, 2016
Applicant:

Corning Incorporated, Corning, NY (US);

Inventors:

Robert Alan Bellman, Painted Post, NY (US);

Robert George Manley, Vestal, NY (US);

Prantik Mazumder, Ithaca, NY (US);

Assignee:

CORNING INCORPORATED, Corning, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C03C 15/02 (2006.01); B32B 17/10 (2006.01); C03C 17/32 (2006.01); C03C 27/10 (2006.01);
U.S. Cl.
CPC ...
C03C 15/02 (2013.01); B32B 17/10036 (2013.01); B32B 17/10128 (2013.01); B32B 17/10577 (2013.01); C03C 17/32 (2013.01); C03C 27/10 (2013.01); B32B 2315/08 (2013.01); B32B 2457/20 (2013.01); C03C 2218/153 (2013.01); C03C 2218/32 (2013.01); C03C 2218/355 (2013.01);
Abstract

An article includes a carrier including a carrier bonding surface, a sheet including a sheet bonding surface, and a surface modification layer disposed on at least one of the carrier bonding surface and the sheet bonding surface. The surface modification layer includes a plasma polymerized material. The plasma polymerized material planarizes the at least one of the carrier bonding surface and the sheet bonding surface. The carrier bonding surface and the sheet bonding surface are bonded with the surface modification layer so that the carrier is temporarily bonded with the sheet. A method of making an article includes depositing a surface modification layer on at least one of a carrier bonding surface and a sheet bonding surface. The method further includes bonding the carrier bonding surface and the sheet bonding surface with the surface modification layer to temporarily bond the carrier with the sheet.


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