The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2024

Filed:

Sep. 07, 2021
Applicant:

Upbeat Technology Co., Ltd, New Taipei, TW;

Inventors:

Hsien-Lung Ho, New Taipei, TW;

Da-Ming Chiang, New Taipei, TW;

Chung-Chieh Chen, New Taipei, TW;

Assignee:

UPBEAT TECHNOLOGY CO., LTD, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 3/00 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0021 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/0118 (2013.01); B81B 2203/0127 (2013.01);
Abstract

A micro-electro-mechanical system acoustic sensor, a micro-electro-mechanical system package structure and a method for manufacturing the same are provided. The micro-electro-mechanical system acoustic sensor comprises a substrate, a cantilever structure and a diaphragm sensor. The cantilever structure is formed on the substrate, and comprises a fixed end and a free cantilever portion extended from the fixed end. The free cantilever portion comprises a free end. The free end and the fixed end are respectively at opposing sides of the free cantilever portion. The free cantilever portion is capable of generating a vibration wave in an empty space. The diaphragm sensor is formed on the substrate, and comprises a diaphragm film, a back plate, and at least one electrical contact point. The back plate and the diaphragm film have a first empty gap there between. The empty space and the first empty gap communicate to each other.


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