The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2024

Filed:

Mar. 29, 2022
Applicant:

Brother Kogyo Kabushiki Kaisha, Nagoya, JP;

Inventors:

Kosuke Nukui, Nagoya, JP;

Kenta Hasebe, Nagoya, JP;

Ai Sakaguchi, Kariya, JP;

Eiichi Fujiwara, Nagoya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65D 75/30 (2006.01); B65D 81/30 (2006.01); B65D 75/58 (2006.01);
U.S. Cl.
CPC ...
B65D 75/30 (2013.01); B65D 75/5866 (2013.01); B65D 81/30 (2013.01);
Abstract

A fluid package, having a pouch with a compartment apartment delimited by a film and a spout, is provided. The film includes an outer layer, an inner layer, a light-shielding layer, and a bonding layer. An outer periphery of the light-shielding layer is located at a position on an inner side of outer peripheries of the outer layer and the inner layer, at one of a position same as an outer periphery of the container compartment and a position on an outer side with respect to the outer periphery of the container compartment. The light-shielding layer covers an entirety of the container compartment and blocks ultraviolet rays. The bonding layer bonds the outer layer and the inner layer with the light-shielding layer interposed there-between. The bonding layer includes a directly-bonded area, in which the outer layer and the inner layer are directly bonded, in a range surrounding the light-shielding layer.


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