The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2024
Filed:
Sep. 27, 2019
Applicant:
Nippon Steel Corporation, Tokyo, JP;
Inventors:
Assignee:
NIPPON STEEL CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B62D 29/00 (2006.01); B32B 7/12 (2006.01); B32B 15/08 (2006.01); B32B 15/18 (2006.01); B62D 27/02 (2006.01);
U.S. Cl.
CPC ...
B62D 29/007 (2013.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 15/18 (2013.01); B62D 27/026 (2013.01); B62D 29/005 (2013.01); B32B 2307/202 (2013.01); B32B 2307/54 (2013.01); B32B 2307/732 (2013.01);
Abstract
This bonded structure includes a first member having a metal portion and a film portion disposed on at least a part of a surface of the metal portion; a second member; an adhesive layer for joining the first member and the second member to each other via the film portion. The film portion contains a resin and inorganic particles. The inorganic particles are formed of ferrosilicon or non-oxide ceramics containing V. Some of the inorganic particles protrude toward the adhesive layer. The particle size of at least some of the inorganic particles protruding toward the adhesive layer is less than the film thickness of the film portion.