The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2024

Filed:

Mar. 29, 2022
Applicants:

Naoto Shimura, Tokyo, JP;

Yuya Hirokawa, Kanagawa, JP;

Yuusuke Koizuka, Shizuoka, JP;

Takayuki Shimizu, Kanagawa, JP;

Itsuro Sasaki, Kanagawa, JP;

Shunsuke Horie, Kanagawa, JP;

Nozomi Terai, Tokyo, JP;

Kenta Hagiwara, Tokyo, JP;

Inventors:

Naoto Shimura, Tokyo, JP;

Yuya Hirokawa, Kanagawa, JP;

Yuusuke Koizuka, Shizuoka, JP;

Takayuki Shimizu, Kanagawa, JP;

Itsuro Sasaki, Kanagawa, JP;

Shunsuke Horie, Kanagawa, JP;

Nozomi Terai, Tokyo, JP;

Kenta Hagiwara, Tokyo, JP;

Assignee:

RICOH COMPANY, LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 11/00 (2006.01); B41M 5/00 (2006.01);
U.S. Cl.
CPC ...
B41J 11/00216 (2021.01); B41M 5/0023 (2013.01);
Abstract

A printing method includes discharging ink to a substrate, heating a non-ink-discharged side of the substrate at T, and heating an ink-discharged side of the substrate at T, wherein the ink contains an organic solvent A (boiling point lower than 250 degrees C.), an organic solvent B (boiling point of 250 degrees C.), and a resin, where 0 degrees C. C≤T−T≤90 degrees C. is satisfied, the proportion (organic solvent A/ink) is 30 percent by mass or less, the proportion (organic solvent B/ink) is 1 to 3 percent by mass, the proportion (resin/ink) is 5 to 15 percent by mass, the ink has a viscosity of 8.0 to 11.0 mPa-s at 25 degrees C. and 5.5 to 11.0 mPa-s at 36 degrees C., and a 2.5 μL ink droplet discharged to the substrate shrinks to 0.1 μL within 10.0 seconds at 25 degrees C.


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