The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2024
Filed:
Feb. 12, 2021
Applicant:
Jsp Corporation, Chiyoda-ku, JP;
Inventors:
Takashi Oi, Tokyo, JP;
Hajime Ohta, Tochigi, JP;
Assignee:
JSP CORPORATION, Chiyoda-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/08 (2006.01); B32B 27/32 (2006.01);
U.S. Cl.
CPC ...
B32B 27/08 (2013.01); B32B 27/32 (2013.01); B32B 2250/02 (2013.01); B32B 2266/025 (2013.01); B32B 2553/00 (2013.01);
Abstract
A molded article of polypropylene-based resin expanded beads, obtained by in-mold molding of the polypropylene-based resin expanded beads, each bead including: a core layer, in a foamed state, having a polypropylene-based resin; and a covering layer, which covers the core layer, having a polyethylene-based resin. A molded article magnification X [times] of the molded article is 55 times to 90 times, a value of a product X·σof a 50% compressive stress σ[kPa] and the molded article magnification X is 6500 or more, and a 5% compressive stress σof the expanded beads molded article is 5 kPa to 25 kPa.