The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2024
Filed:
Sep. 28, 2020
Applicant:
Fujimori Kogyo Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
FUJIMORI KOGYO CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/12 (2006.01); B32B 27/08 (2006.01); B29C 48/08 (2019.01); B29C 48/21 (2019.01); B29C 48/00 (2019.01); B32B 27/32 (2006.01); B32B 27/38 (2006.01); C09J 125/08 (2006.01); C09J 123/26 (2006.01); C08L 23/06 (2006.01); C08L 23/20 (2006.01); C09J 7/35 (2018.01); B32B 27/00 (2006.01); C09J 151/06 (2006.01); C09J 163/00 (2006.01); C09J 7/29 (2018.01); B32B 27/20 (2006.01); B32B 27/30 (2006.01); B32B 27/34 (2006.01); B05D 1/26 (2006.01); B29K 9/00 (2006.01); B29K 19/00 (2006.01); B29K 23/00 (2006.01); B29K 33/00 (2006.01); B29K 63/00 (2006.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
B32B 27/08 (2013.01); B29C 48/022 (2019.02); B29C 48/08 (2019.02); B29C 48/21 (2019.02); B32B 27/00 (2013.01); B32B 27/20 (2013.01); B32B 27/302 (2013.01); B32B 27/32 (2013.01); B32B 27/325 (2013.01); B32B 27/327 (2013.01); B32B 27/34 (2013.01); B32B 27/38 (2013.01); C08L 23/06 (2013.01); C08L 23/20 (2013.01); C09J 7/29 (2018.01); C09J 7/35 (2018.01); C09J 123/26 (2013.01); C09J 125/08 (2013.01); C09J 151/06 (2013.01); C09J 163/00 (2013.01); B05D 1/265 (2013.01); B29K 2009/00 (2013.01); B29K 2019/00 (2013.01); B29K 2023/06 (2013.01); B29K 2023/12 (2013.01); B29K 2033/08 (2013.01); B29K 2063/00 (2013.01); B29K 2105/0097 (2013.01); B32B 2250/05 (2013.01); B32B 2250/24 (2013.01); B32B 2250/40 (2013.01); B32B 2270/00 (2013.01); B32B 2307/306 (2013.01); B32B 2405/00 (2013.01); C09J 2301/124 (2020.08); C09J 2301/304 (2020.08); C09J 2423/006 (2013.01); C09J 2451/00 (2013.01); C09J 2463/00 (2013.01); Y10T 428/2813 (2015.01); Y10T 428/2848 (2015.01);
Abstract
A hot-melt adhesive resin film includes a first adhesive layer, a first intermediate layer, a substrate layer having heat resistance, a second intermediate layer, and a second adhesive layer, which are laminated in this order, in which the first adhesive layer and the second adhesive layer include an acid-modified polyolefin resin.