The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2024

Filed:

Oct. 06, 2021
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Steven M. Zuniga, Soquel, CA (US);

Andrew Nagengast, Sunnyvale, CA (US);

Jay Gurusamy, Santa Clara, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 37/005 (2012.01); B24B 37/12 (2012.01); B24B 37/20 (2012.01); B24B 37/02 (2012.01);
U.S. Cl.
CPC ...
B24B 37/005 (2013.01); B24B 37/02 (2013.01); B24B 37/12 (2013.01); B24B 37/20 (2013.01);
Abstract

An apparatus for chemical mechanical polishing (CMP) of a substrate is described herein. The apparatus includes an extension disposed between a retaining ring and a chucking membrane. The extension is disposed radially outward from the edge of the substrate and is configured to contact the retaining ring during substrate processing. The extension provides a repeatable and controlled point of contact between the retaining ring and the chucking membrane. The extension may have multiple configurations, such that the contact point between the retaining ring and the chucking membrane is set at a pre-determined location or such that the contact point is moveable by an adjustable stop.


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