The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2024
Filed:
Apr. 29, 2022
Changsha University of Science and Technology, Hunan, CN;
Cong Mao, Hunan, CN;
Weidong Tang, Hunan, CN;
Yuanqiang Luo, Hunan, CN;
Yinghui Ren, Hunan, CN;
Wei Li, Hunan, CN;
Mingjun Zhang, Hunan, CN;
Kun Tang, Hunan, CN;
Gang Wu, Hunan, CN;
Yongle Hu, Hunan, CN;
Feng Shi, Hunan, CN;
Ziyang Chen, Hunan, CN;
Zhuo Wen, Hunan, CN;
Changsha University of Science and Technology, Changsha, CN;
Abstract
This paper describes an invention involving an electrochemical discharge-enabled micro-grinding process for micro-components of silicon-based materials. The specific machining method is described below. A micro-grinding tool and an auxiliary electrode are respectively connected to the negative and positive electrodes of a pulsed DC power supply. When the current flows through the loop, an electrochemical hydrogen evolution reaction (HER) occurs at the micro-grinding tool in the grinding fluid, which generate multiple hydrogen bubbles. The bubbles coalesce into an insulating gas film and separate the micro-grinding tool from the grinding fluid; when the critical voltage is reached, the gas film is broken down and an electrochemical discharge occurs accompanied by discharge spark; under the action of the discharge spark, the surface material of the workpiece in the discharge-affected region is directly ablated to generate a heat-affected layer (HAL), namely, physical modification.