The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2024

Filed:

Jul. 28, 2020
Applicant:

GM Global Technology Operations Llc, Detroit, MI (US);

Inventors:

Erik B. Golm, Warren, MI (US);

Louis G. Hector, Jr., Shelby Township, MI (US);

Anil K. Sachdev, Rochester Hills, MI (US);

Andrew C. Bobel, Troy, MI (US);

Kevin B. Rober, Washington, MI (US);

Jianfeng Wang, Jiangsu, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21D 37/10 (2006.01); B21D 37/16 (2006.01); B21D 13/02 (2006.01); B62D 21/15 (2006.01);
U.S. Cl.
CPC ...
B21D 37/10 (2013.01); B21D 13/02 (2013.01); B21D 37/16 (2013.01); B62D 21/15 (2013.01); Y10T 428/12417 (2015.01);
Abstract

An energy-dissipating cover for covering a component sensitive to mechanical impulse includes a sheet of selected ferrous or aluminum alloy, the sheet having a top surface, a bottom surface, an outer perimeter, an overall area within the outer perimeter and a nominal thickness of no more than 2.5 mm. The sheet is configured for connection with one or more external structures at a plurality of connection points within the outer perimeter, wherein the overall area comprises a plurality of supported areas and at least one unsupported area. Embossments are formed within the at least one unsupported area and extend outward from the bottom surface. The embossments are shaped, sized and arranged so as to limit orthogonal deflection of the sheet from a mechanical impulse directed normal to the bottom surface of the sheet at the plurality of embossments.


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