The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2024

Filed:

Sep. 20, 2018
Applicants:

The Regents of the University of California, Oakland, CA (US);

Hypothermia Devices, Inc., Los Angeles, CA (US);

Inventors:

Julio L. Vergara, Los Angeles, CA (US);

Daniel M. Estrada, Los Angeles, CA (US);

Mayank Kalra, Los Angeles, CA (US);

Andrew Padula, Laguna Niguel, CA (US);

Ryan Cohn, Los Angeles, CA (US);

Assignees:

THE REGENTS OF THE UNIVERSITY OF CALIFORNIA, Oakland, CA (US);

HYPOTHERM DEVICES, INC., Los Angeles, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61F 7/02 (2006.01); A61F 7/00 (2006.01); F25B 21/02 (2006.01); F28F 9/18 (2006.01); F28F 3/08 (2006.01);
U.S. Cl.
CPC ...
A61F 7/02 (2013.01); A61F 7/007 (2013.01); F25B 21/02 (2013.01); F28F 3/08 (2013.01); F28F 9/18 (2013.01); A61F 2007/0002 (2013.01); A61F 2007/0039 (2013.01); A61F 2007/0056 (2013.01); A61F 2007/0075 (2013.01); A61F 2007/0233 (2013.01); A61F 2007/0255 (2013.01); F24H 2250/06 (2013.01); F25B 2321/025 (2013.01); F25B 2700/21 (2013.01); F28F 2275/025 (2013.01); F28F 2275/06 (2013.01); F28F 2275/085 (2013.01);
Abstract

A heat exchange module alone or part of a system including a control console. The HEM can include a channel enclosure assembly, a thermoelectric cooler (TEC) assembly and a heat transfer (cover) assembly. The enclosure assembly includes a channel for a heat-transfer liquid. The module can be constructed to provide for flexibility to better conform and fit on rounded and/or angular body parts and to efficiently transfer heat between the adjacent body part and the heat-transfer liquid via the TECs of the TEC assembly.


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