The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2024

Filed:

May. 12, 2022
Applicant:

Fujifilm Healthcare Corporation, Kashiwa, JP;

Inventors:

Hidetsugu Katsura, Tokyo, JP;

Yoshihiro Tahara, Tokyo, JP;

Kazuhiro Kobayashi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10N 30/03 (2023.01); H10N 30/081 (2023.01); A61B 8/00 (2006.01); H10N 30/02 (2023.01); H10N 30/084 (2023.01); G01N 29/22 (2006.01);
U.S. Cl.
CPC ...
H10N 30/03 (2023.02); A61B 8/4444 (2013.01); A61B 8/4483 (2013.01); H10N 30/02 (2023.02); H10N 30/081 (2023.02); H10N 30/084 (2023.02); G01N 29/226 (2013.01); Y10T 29/42 (2015.01); Y10T 29/49005 (2015.01); Y10T 29/49121 (2015.01);
Abstract

The present invention is directed to improving an insulating property of a backing in which a lead array is buried. The method includes a coating forming process, in which insulating coatings are formed with respect to at least a plurality of lead rows included in a plurality of lead frames; after the forming of the insulating coatings, a plate manufacturing process, in which a plurality of backing plates are manufactured by pouring a backing material towards a lead row in each of the plurality of lead frames so that the lead row and the backing material are integrated with each other; and a laminating process, in which the plurality of backing plates are laminated.


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