The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2024
Filed:
Oct. 04, 2019
Applicant:
Kelk Ltd., Kanagawa, JP;
Inventors:
Toshihiko Kishizawa, Kanagawa, JP;
Shinichi Fujimoto, Kanagawa, JP;
Manabu Ishii, Tokyo, JP;
Hideaki Yamagishi, Tokyo, JP;
Fumitaka Ueno, Tokyo, JP;
Assignee:
KELK Ltd., Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10N 10/817 (2023.01); H10N 10/852 (2023.01); H10N 10/01 (2023.01);
U.S. Cl.
CPC ...
H10N 10/817 (2023.02); H10N 10/852 (2023.02); H10N 10/01 (2023.02);
Abstract
A thermoelectric module includesa plurality of electrodes (high temperature side electrodes and low temperature side electrodes, thermoelectric conversion elements (p-type element and n-type element) arranged between the two electrodes, and a bonding layer disposed between the electrodes and the thermoelectric conversion elements. The bonding layer includes copper-containing particles, copper balls each having a particle diameter of 30 μm or more, an intermetallic compound of copper and tin, and a fired resin.