Apparatus and methods of passive cooling electronic components

Abstract

An electronic component heat dissipation apparatus and methods having a heat dissipation housing. The heat dissipation housing having an external wall and an internal wall defining outer chamber therebetween. The internal wall defines an internal chamber having an airflow inlet opening and an airflow outlet opening. The housing is aligned with at least one electronic component so as to define a thermal chimney through the internal chamber for the flow of heated air. The external wall has at least one external air opening configured to allow external air into the outer chamber. The internal wall has a plurality of heat dissipation nozzles. Each heat dissipation nozzle has an external air inlet opening located within the internal wall and an external air outlet opening located within the internal chamber. The diameter of the external air inlet opening is greater than the diameter of the external air outlet opening. This allows external air to be pushed and/or pulled through the plurality of heat dissipation nozzles from the outer chamber into the internal chamber at an increasing velocity. The external air is then mixed with the flow of heated air thereby increasing the speed of the flow of heated air though the internal chamber.