The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2024
Filed:
May. 29, 2020
Kyocera Corporation, Kyoto, JP;
Tomoya Nagase, Kurobe, JP;
Takashi Ishioka, Namerikawa, JP;
Kyocera Corporation, Kyoto, JP;
Abstract
A printed wiring board is provided with: a core substrate corresponding to a stack area in which an interlayer connection conductor constituting an inner via is continuous; and a build-up layer comprising a resin layer stacked on the core substrate and a conductor layer on said resin layer. A via inner space inside the interlayer connection conductor constituting the inner via is hollow, and said via inner space communicates to the outside via a hole section provided in the build-up layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile