The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2024

Filed:

Aug. 25, 2023
Applicant:

Masimo Corporation, Irvine, CA (US);

Inventors:

Benjamin C. Triman, Rancho Santa Margarita, CA (US);

John Schmidt, Lake Forest, CA (US);

Yassir Kamel Abdul-Hafiz, Irvine, CA (US);

Ammar Al-Ali, San Juan Capistrano, CA (US);

Assignee:

Masimo Corporation, Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 5/00 (2006.01); A61B 5/024 (2006.01); A61B 5/1455 (2006.01); H05K 3/00 (2006.01); H05K 3/22 (2006.01); A61B 5/026 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/22 (2013.01); A61B 5/0059 (2013.01); A61B 5/1455 (2013.01); H05K 3/0097 (2013.01); A61B 5/0261 (2013.01); A61B 2562/0233 (2013.01); A61B 2562/0238 (2013.01); A61B 2562/12 (2013.01); A61B 2562/164 (2013.01); A61B 2562/166 (2013.01); A61B 2562/182 (2013.01); H05K 1/189 (2013.01); H05K 3/0052 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/1545 (2013.01);
Abstract

Various sensors and methods of assembling sensors are described. In some embodiments, the sensor assembly includes a first end, a body portion, and a second end. The first end can include a neck portion and a connector portion and the second end can include a flap, a first component, a neck portion, and a second component. A method is also described for sensor folding. The method can include using a circuit with an attached emitter and a detector that is separated by a portion of the circuit. The method can also include folding the portion of the circuit such that a first fold is created through the emitter and folding the portion of the circuit such that a second fold is created such that the first fold and second fold form an angle.


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