The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2024

Filed:

Aug. 10, 2018
Applicant:

Sony Semiconductor Solutions Corporation, Kanagawa, JP;

Inventors:

Hajime Hosaka, Kanagawa, JP;

Kenichi Okumura, Tokyo, JP;

Yoshikazu Nitta, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/33 (2023.01); G01J 5/14 (2006.01); G01K 7/01 (2006.01); G06V 40/13 (2022.01); H04N 23/62 (2023.01); G01J 5/00 (2022.01);
U.S. Cl.
CPC ...
H04N 5/33 (2013.01); G01J 5/14 (2013.01); G01K 7/01 (2013.01); G06V 40/1318 (2022.01); H04N 23/62 (2023.01); G01J 2005/0077 (2013.01);
Abstract

An imaging device includes a first structure, and a second structure, in which the first structureincludes a first substrate, a temperature detection element which is formed on the first substrateand detects a temperature on the basis of an infrared ray, a signal line, and a drive line, the second structureincludes a second substrate, and a drive circuit provided on the second substrateand covered with a covering layer, the first substrateand a second electrodeare stacked, the signal lineis electrically connected with the drive circuit via a signal line connection portion, the drive line is electrically connected with the drive circuit via a drive line connection portion, and the signal line connection portionincludes a first signal line connection portionformed in the first structureand a second signal line connection portionformed in the second structure


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